Sondhi™ Rapid-Set Indirect Bonding Adhesive
The Sondhi™ Rapid-Set Indirect Bonding Adhesive is a cut above the rest. While this lightly filled resin cures twice as fast as conventional indirect adhesives, it achieves two thirds of its bond strength within the first five minutes.
Designed to complement our APC™ Adhesive Coated Appliances, the Sondhi Rapid-Set Indirect Bonding Adhesive offers all the benefits of indirect bonding.
- Greater accuracy in bracket placement
- Lesser bracket repositioning
- Decreased chair time and enhanced patient comfort
- Maximization of doctor time
For the doctor, this ensures greater control over bracket placement and a higher level of precision, in addition to reduced stress and lesser time per patient. For the patient, this translates into a faster, comfortable and confident bonding experience.
